PARMI HS60XXL Solder Paste Inspector 3D Laser SPI Machine

Key Features of PARMI SPI HS60 and Related Models
1. Advanced Inspection Technology:

3D Laser Triangulation Sensor: Provides robust 3D data and profiles the real shape of features, offering high accuracy against variations in materials and surface conditions.

Dual Laser Projection: Eliminates shadow effects, allowing for precise measurement of components, even those with significant height differences.

2. Real-Time Warpage Tracking:

Accurately measures PCB warpage up to ±5mm using real-time Z-axis control and scanning.

3. Component Inspection:

Can inspect components up to 65mm in height using a multi-step scanning method, providing industry-leading height measurement capabilities.

4. User Interface and Control:

Features a user-friendly interface with graphical windows for easy operation and setup.

Supports remote management of multiple SPI systems, reducing manpower needs while maintaining consistent quality.

5. Inspection Speed and Resolution:

Models like the HS60 Supreme offer inspection speeds of 100cm²/sec at resolutions of 13x13μm. However, specific speeds for the HS60XXL are not detailed.

6. Material Compatibility:

PARMI's inspection technology is compatible with various materials and surface conditions, unaffected by color or material variations.

PARMI SPI HS60XXL SOLDER PASTE INSPECTOR

HS60XXL SOLDER PASTE INSPECTOR

PARMI SPI HS60XXL

PARMI HS60XXL Solder Paste Inspector 3D Laser SPI Machine Images